Wafer Grinder/Lapping Machine

DXSG320

Application Example(s): Wafers


Industry: Information Technology/Semiconductor


Grinding Capacity/Lapping capacity: Ø200 – Ø300mm


Description: Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers.

R631DF

Application Example(s): Wafers


Industry: Information Technology/Semiconductor


Grinding Capacity/Lapping capacity: Ø200mm


Description: Special grinder for hard but brittle wafers. High-precision grinder to replace lapping machines. Fully automated cassette to cassette operation. Grinding parameters of each wafer can be stored.