Special Grinding Machines

MG32AIP

Multi-Head Grinder

Workpiece DxL(mm) Ø200~x80 Application Example (CVT Pulley)
Grinding Wheel DxW (mm) Diagonal Ø610x63
Bore Ø50x12,7
Floor Space WxD (mm) 3,900x3,000
Machine Weight (kg) 14,000

DXSG320

Wafer Grinder

Workpiece D(mm) Ø300•Ø200 Simultaniously grinding both faces of Silicon Wafers, with a 90 sec cycle time for Ø300mm diameter wafers.
Grinding Wheel D(mm) Ø160•Ø110
Floor Space WxD (mm) 1,720x2,180
Machine Weight (kg) 4,900

SAM-084

Internal Slot Grinder

Workpiece DxL(mm) Ø105~35 Grinding the vane slot on rotary compressor cylinders.
Grinding Wheel DxW (mm) Ø62xMIN,3
Floor Space WxD (mm) 1,350x1,855
Machine Weight (kg) 4,000

3RG-450

Race Grinder

Workpiece DxW(mm) Ø10~Ø160xMAX.50 Race and Chuck grinder
Grinding Wheel DxW (mm) Ø455x50
Floor Space WxD (mm) 2,100x1,700
Machine Weight (kg) 5,000

1M-350

Small Race Grinder

Workpiece DxW(mm) Ø1.5~13x1~18 Minature bearing races
Grinding Wheel DxW (mm) Ø355x16
Floor Space WxD (mm) 1,560x1,200
Machine Weight (kg) 1,500